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      • The Allegro X Advanced Package Designer course provides all the essential training required to start working with Allegro X Advanced Package Designer. The course covers all the design tasks, including importing IC data, BGA generation and connectivity generation, constraints setup, placement, routing, post-processing, and Gerber generation.
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  2. In this course, you learn the complete flow of a package design, from defining the module outline to placing components, defining a netlist, placement, routing, documentation, and manufacturing output.

  3. Nov 18, 2022 · The Allegro X Advanced Package Designer course provides all the essential training required to start working with Allegro X Advanced Package Designer. The course covers all the design tasks, including importing IC data, BGA generation and connectivity generation, constraints setup, placement, routing, post-processing, and Gerber generation.

  4. Allegro X Advanced Package Designer allows teams to effortlessly design multi-die packages with on-the-fly library creation, die stacking, embedded cavities, and custom manufacturing outputs using industry-leading design rules.

  5. Starting SPB 23.1, Allegro Package Designer Plus (APD+) has been rebranded as Allegro X Advanced Package Designer (Allegro X APD). The splash screen for Allegro X APD will appear as shown below, instead of showing APD+ 2023:

  6. Allegro X Advanced Package Designer includes all the functionality and features needed to design today’s advanced packages. Full online design rule checking (DRC) supports the complex, unique requirements of all combinations of laminate, ceramic, and silicon-based substrate technologies.

  7. Jan 16, 2024 · The Allegro X Design Platform page is created for the users of our Cadence Online Support portal to provide insights into the revolutionizing and evolving Allegro X Design platform. This page equips you with the necessary resources to help you design, simulate, and manufacture complex PCBs.

  8. Design advanced high-density single-die and multi-die packages with the industry-leading correct-by-design implementation solution