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      • The Allegro X 24.1 update expands upon our scalable, secure, and highly integrated environment with design accelerators, managed libraries, in-design analyses to ensure product compliance and reliability, ZTNA infrastructure, 3D board-level mapping, and routing enhancements to provide first pass success.
      resources.pcb.cadence.com/blog/whats-new-in-allegro-x

      What's New in Allegro X - Cadence PCB Design & Analysis

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  3. www.cadence.com › allegro-x-advanced-designerAllegro X Advanced Package - Cadence Design Systems

    Allegro X Advanced Package Designer allows teams to effortlessly design multi-die packages with on-the-fly library creation, die stacking, embedded cavities, and custom manufacturing outputs using industry-leading design rules.

  4. resources.pcb.cadence.com › whats-new-in-allegro-xWhat's New in Allegro X - Cadence PCB Design & Analysis

    Sep 20, 2024 · The Allegro X 24.1 update expands upon our scalable, secure, and highly integrated environment with design accelerators, managed libraries, in-design analyses to ensure product compliance and reliability, ZTNA infrastructure, 3D board-level mapping, and routing enhancements to provide first pass success. Schematic Capture.

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  6. community.cadence.com › cadence_blogs_8 › bWhat is new in Cadence OrCAD X and Allegro X 231

    Nov 2, 2023 · A new Sigrity XtractIM workflow offering quick package design parasitic analysis is added to Allegro X Advanced Package Designer. Two new analyses are also supported, Per Pin (Die-side Power) and Per Net (Signal).

  7. community.cadence.com › cadence_blogs_8 › bLearn 22.1 Allegro Package Designer Plus Online

    • Creating A BGA Component with The BGA Generator
    • Importing Die Information Into Allegro X Advanced Package Designer
    • Assigning Die to BGA Pins
    • Checking 3D Wire Bond

    The BGA component is the interface from an IC Package design to the next level carrier in the system, which is usually the printed circuit board. In Module 3 of the course, you learn how to use the BGA Generator to create a 421-pin BGA component and then use the Symbol Edit application mode in Allegro X Advanced Package Designer to modify the BGA.

    See full list on community.cadence.com

    Die information can be imported into the Allegro X Advanced Package Designerenvironment in many ways including a Die Generator Text-in Wizard, or by importing GDSII data and converting it into a Die symbol. In Module 4, first, you learn to create a flip-chip die by importing information from a text file, and then create a wire bond die by importing...

    See full list on community.cadence.com

    One of the main tasks in IC Package design is Die to BGA pinout assignments. Allegro X Advanced Package Designerhas many features that quickly and automatically optimize the Die to BGA pinout assignments in a package design. In Module 5, you will learn how to assign die pins to BGA pins using the Auto Assign Net command by specifying the shortest M...

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    Wire bonds are the electrical connections from the wire bond die to the surface of the IC Package substrate. Visualizing these elements in three dimensions is critical to ensure the connection between the die and substrate. In Module 7, you define 3D wire bond profiles and add wire bonds from your die pins to bond fingers on the surface of the IC P...

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  8. community.cadence.com › cadence_blogs_8 › bWhat's New in Allegro X PCB Editor in Release 231 - System ...

    Nov 21, 2023 · Release 23.1 introduces several new features and enhancements in the two layout editors, Allegro X PCB Editor and Allegro X Advanced Package Designer. These changes are geared to make the design process smoother and smarter for you with condensed timelines and superior workflows.

    • What's new in Allegro package designer?1
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  9. www.cadence.com › en_US › homeAllegro X Advanced Package Designer - Cadence Design Systems

    Allegro X Advanced Package Designer not only bridges the gap between silicon and package design, but also links package and PCB design. All data required for PCB-level floorplanning and layout is automatically generated—physical footprint, schematic symbol, and device models.

  10. newstaging.cadence.com › p_r_e_view › homeAllegro X Advanced Package Designer | Cadence

    Design advanced high-density single-die and multi-die packages with the industry-leading correct-by-design implementation solution