Yahoo India Web Search

Search results

  1. Apr 27, 2023 · A new method enables 2D-material semiconductor transistors to be directly integrated onto a fully fabricated 8-inch silicon wafer, which could enable a new generation of transistor technology, denser device integration, new circuit architectures, and more powerful chips.

  2. Sep 1, 2023 · Two-dimensional transition metal dichalcogenides (TMDs), with their atomically thin structure and enticing physical properties, have emerged as the most promising candidates for downsizing and improving device integration.

  3. 1. Introduction. neering and physics challenges [1, 2, 3]. From the hardware perspective, scaled-up circuit designs and fabrication processes must not degrade the device performance, which otherwise would adversely.

  4. Abstract: In this paper, two transition circuits to assemble chips using coplanar waveguide (CPW) without back conductor at terahertz (THz) band are presented. The first transition circuit is adopting a CPW to microstrip line (MSL) transition circuit.

  5. Dec 12, 2023 · The chip transition from continuously serrated to discontinuously segmented is one of the most fundamental and challenging problems in metal cutting. In this work, a reliable finite element model for high speed cutting of Ti-6Al-4 V was developed based on the high speed cutting experiments.

  6. This letter presents an innovative inline waveguide-to-chip transition for MMIC packaging. The design proposes a Y-shaped quasi-Yagi antenna concept, which aims to enhanced coupling efficiency and an extended operating frequency bandwidth.

  7. People also ask

  8. Abstract: This paper presents a 300GHz band probe-type chip-to-waveguide transition implemented on standard 65nm CMOS process. This design utilizes the bump from flip-chip packaging process and the PCB top metal to form a back-short structure.