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Tensilica Inc. was a company based in Silicon Valley in the semiconductor intellectual property core business. It is now a part of Cadence Design Systems.. Tensilica offers customizable Xtensa microprocessor cores. Its product lineup includes HiFi audio/voice DSPs (digital signal processors) with a software library of over 225 codecs from Cadence and over 100 software partners, Vision DSPs designed for imaging, video, computer vision, and neural networks, and the ConnX family of baseband ...
De-Facto Standard in Customizable Processors. Cadence Tensilica Xtensa processors combine the best of CPUs, GPUs, FPGAs, and dedicated custom RTL in ASICs/SoCs and enable the development of energy-efficient domain-specific processors that offer high performance, flexibility for future-proofing, and more importantly, can be tailored for your specific application requirements.
Customers can quickly create differentiated, domain-specific processors for their application needs with the help of Cadence Compute IP, which includes Tensiica Xtensa extensible processors, Tensilica application-specific DSPs, Neo NPUs, and system IP with network on chip (NoC). Part of the Cadence.AI Generative AI Platform, this broad range of ...
The Cadence Tensilica Xtensa LX processor platform offers the most versatility by enabling the configuration of several pre-defined processor elements and extending the architecture by creating entirely new instructions and hardware execution units as well as custom memory paths and data I/O paths. Cadence is pleased to introduce Xtensa LX8 ...
Oct 14, 2013 · Friday, August 30, 2013. Today's moving day! Tensilica employees are moving to the Cadence campus. It's work-from-home days while the trucks move our stuff over to the Cadence campus. Our new office address is 2655 Seely Avenue, Building 8, San Jose, CA 95134. The main phone number is 408-943-1234.
Apr 4, 2003 · How Tensilica verifies processor cores. Thanks to the relentless enforcement of Moore's Law by semiconductor vendors, system-on-chip (SoC) design is now stuck in a messy verification quagmire. Most estimates place verification at around 50-80% of the overall design effort for mega-gate SoC designs. Custom-built RTL hardware blocks require ...
Apr 21, 2010 · See Tensilica for DSPs and all the processing you need to do in the dataplane (dataplane processors - DPUs). Follow us on: Wednesday, April 21, 2010. Xtensa 8 or Xtensa LX3 - Which is Right for You? Xtensa LX3 is a super-set of all Xtensa 8 features. But do you really need them all?
Mar 8, 2013 · Tensilica offers a line of controller, CPUs, and specialty DSP processors, in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. Tensilica’s processors have been implemented into high-volume products for industries including digital consumer, networking ...
Tensilica was acquired by Cadence Design Systems, Inc., in 2013. Cadence is actively investing in the innovative Tensilica processor architecture, as well as hiring new engineers and marketing people.
Aug 4, 2023 · The Tensilica Xtensa LX8 processor platform is the foundation for the eighth generation of its industry-leading Xtensa LX processor family. This adds new digital signal processing (DSP) blocks, multi-processor, interconnect and system-level IP to meet the system-level performance and AI requirements of system on chip designs.
May 16, 2019 · Tensilica’s Desai gave two examples: GEO Semiconductor (San Jose) and Vayyar Imaging. GEO Semiconductor uses Vision P5 DSP in a rearview-camera video processor. “Intelligence inside the chip allows the rearview camera to detect what it is the processor is seeing,” explained Desai.
Tensilica Instruction Extension (TIE) The Cadence ® Tensilica ® Instruction Extension (TIE) language is a processor description language that provides a powerful way to optimize Tensilica Xtensa ® processors and extend the functionality of the processors by defining custom execution units, register files, I/O interfaces, load/store instructions, and multi-issue instructions without having to worry about pipelining, control/bypass logic, and interfacing to other processor modules as the ...
Jul 21, 2021 · The new Cadence Tensilica FloatingPoint DSP family delivers scalable performance for a broad range of compute-intensive applications featuring an extremely low power consumption. The low-energy DSP IP optimizes power, performance and area (PPA), allowing for an up to 40% area savings for mobile, automotive, consumer and hyperscale computing ...
May 15, 2019 · Tensilica. Vision Q7. 0 Comments. Last year we saw the announcement of Cadence’s Tensilica Q6 DSP IP which promised a new architecture that brings integration between vision DSP workloads and ...
May 31, 2012 · There's a powerful way to optimize an Xtensa processor-through a processor-description language called TIE, Tensilica's Instruction Extension language. TIE is a simple way to make Xtensa processor cores faster and more efficient by adding new task-optimized instructions and I/O interfaces.
Oct 24, 2023 · SAN JOSE, Calif., October 24, 2023--Cadence expanded its Tensilica HiFi and Vision DSP families to address system-level performance and AI requirements with greater energy efficiency.
Feb 29, 2024 · WTS. Cadence Design Systems CDNS expanded its Tensilica IP lineup to cater to the rising computational demands in automotive sensor fusion applications. The latest high-performance Cadence ...
The Cadence Silicon Solutions Portfolio includes silicon-proven Tensilica and Neo AI IP cores, advanced memory interfaces, and high-speed SerDes that are all based on industry-standard protocols. To achieve first-time silicon success, let Cadence help you choose the right IP, subsystem, or silicon solution and capture its full value in your ...
Nov 2, 2009 · The base Xtensa LX3 DPU configuration can reach speeds of over 1 GHz in 45nm process technology (45GS) with an area of just 0.037 mm 2 and power of 0.015 mW/MHz. When built with the new ConnX Baseband Engine DSP (ConnX BBE), the Xtensa LX3 processor delivers over 10 Giga-MACs-per-second performance, running at 625 MHz with a footprint of 0.93mm ...
Mouser offers inventory, pricing, & datasheets for ARM Cortex M0+, ARM Cortex M4, ARM Cortex M4F, ARM Cortex M7, Tensilica LX6 Core Development Boards & Kits - ARM. Skip to Main Content +65 6788-9233. Contact Mouser (Singapore) +65 6788-9233 | Feedback. Change Location English SGD
Overview. Today’s applications processors and GPUs are not equipped to handle the complex embedded imaging and vision digital signal processing functions needed in the mobile handsets, drone, automotive, robotics, surveillance, and augmented reality (AR) / virtual reality (VR) markets. The Cadence Tensilica Vision DSP and accelerator family ...
2 days ago · Cadence introduced the Tensilica DNA 100, which is a comprehensive SoC for domain-specific on-device AI edge accelerators . It has low-, mid-, and high-end AI products. Tensilica DNA 100 offers 8 GOPS to 32 TOPS AI processing performance currently and predicts 100 TOPS in future releases . The target applications of the DNA 100 include IoTs ...
Cadence award-winning online support available 24/7. All Courses. Mixed-Signal Design Modeling, Simulation and Verification (9) All Courses Learning Map. Cadence Training Services learning maps provide a comprehensive visual overview of the learning opportunities for Cadence customers. They provide recommended course flows as well as tool ...
Tensilica AI Platform. On-device AI IP. IC Design & Verification. Virtuoso Studio. Analog and custom IC design. Spectre Simulation. Analog and mixed-signal SoC verification Innovus Implementation System. Physical design for advanced nodes. Xcelium Logic Simulation.
