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Jun 24, 2024 · Ensuring the general efficacy and goodness for human beings from medical large language models (LLM) before real-world deployment is crucial. However, a widely accepted and accessible evaluation process for medical LLM, especially in the Chinese context, remains to be established. In this work, we introduce "MedBench", a comprehensive, standardized, and reliable benchmarking system for Chinese medical LLM. First, MedBench assembles the currently largest evaluation dataset (300,901 questions ...
Jul 7, 2024 · 2.1 Face Forgery Detection. Deep learning techniques, particularly convolutional neural networks, have shown remarkable performance in face forgery detection. Based on the research of Rossler A [], XceptionNet [] has been widely used for deepfake detectiondue to its effectiveness in capturing subtle artifacts introduced during the face manipulation process.
Jul 6, 2024 · Lingyue Qin, Boxin Zhao, Jialiang Hua, Xiaoyang Dong, Xiaoyun Wang: Weak-Diffusion Structure: Meet-in-the-Middle Attacks on Sponge-based Hashing Revisited. IACR Cryptol. ePrint Arch. 2023 : 518 ( 2023 )
2 days ago · Nano-Micro Letters is an open-access journal focused on all aspects of nano- or microscale structure and systems from science to technologies. Publishing ...
Jun 24, 2024 · Abstract: Ensuring the general efficacy and goodness for human beings from medical large language models (LLM) before real-world deployment is crucial. However, a widely accepted and accessible evaluation process for medical LLM, especially in the Chinese context, remains to be established.
Jul 9, 2024 · Inspired by the hunt for new phases of matter in quantum mixed states, it has recently been proposed that the equivalence of microcanonical and canonical ensembles in statistical mechanics is a manifestation of strong-to-weak spontaneous symmetry breaking (SWSSB) in an underlying many-body quantum description.
Jun 30, 2024 · Xi Ding, Ming Tao, Junhua Li, Mingyuan Li, Mengchao Shi, Jiashu Chen, Zhen Tang, Francis Benistant, Jie Liu Materials Science in Semiconductor Processing, 2022, 143, 106513. DOI: 10.1016/j.mssp.2022.106513
