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Jun 10, 2024 · The real shock is HiSilicon has a 7x (SASP which can drive down metal pitch to 12nm) patent that incorporate self-aligned vias & cuts (WIPO patent application # CN2022/097621).
5 days ago · HiSilicon Kirin 9000s (Hi36A0) powers the Huawei Mate 60 Pro, manufactured in SMIC’s 7nm N+2 technology (its second-generation 7nm process). This is the first commercial use TechInsights has identified of the most advanced logic process node without extreme ultraviolet (EUV), manufactured by a Chinese foundry, that supports full system-on ...
Jun 22, 2024 · The Huawei-derived HiSilicon SoC has quad 64-bit CPU cores and an AI accelerator that can achieve up to 8 TOPS of performance. The architecture also includes an unknown GPU.
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5 days ago · The HiSilicon 9000s (Hi36A0 GFCV120) powers the latest flagship, the Mate 60 Pro smartphone released in September 2023, from China-based Huawei, a surprise announcement despite US sanctions.
Jun 3, 2024 · HiSilicon, the semiconductor arm of Huawei Technologies Co, became the first Chinese mainland company to enter the Top 10 global chip rankings by taking the 10th position among global firms during the first quarter of the year, a new report said.
Jun 18, 2024 · The HiSilicon Kirin 9000s Hi36A0 GFCV120 component measures 14.52 mm ×14.20 mm ×0.58 mm thick package-on-package (PoP), flip-chip ball grid array (FCBGA) and contains the Hi36A0 GFCV120 processor and a DRAM package.
Jun 21, 2024 · While the KunPeng Pro resembles many other modern SBCs, it utilises the little known HiSilicon Hi1910 SoC, as well as LPDDR4X RAM and eMMC flash storage.
